收藏本站

Pressure
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by
integrating the shear–stress strain gauge, temperature
compensation, calibration, and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the configuration in the basic chip
carrier (case 1317) prior to porting. A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm. The gel die coat and durable thermoplastic
package provide a media resistant barrier that allows the
sensor to operate reliably in high humidity conditions as well
as common automotive media. NOTE: The MPXHZ6116A
series pressure sensor ’s operating characteristics, internal
reliability and qualification tests are based on use of air as the
pressure media. Media, other than air, may have adverse
effects on sensor performance and long–term reliability.
Contact the factory for information regarding media
compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Fluoro Silicone
Gel Die Coat
Die
Stainless
Steel Cap
+5.0 V
Wire Bond
Lead
Frame
P1
Thermoplastic
Case
100 nF
V S Pin 2
MPXHZ6116A
V out Pin 4
to ADC
Sealed Vacuum Reference
Absolute Element
Die Bond
GND Pin 3
47 pF
51 K
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Typical Application Circuit
V out = V S (0.008938 x P (kPa) - 0.09895)
± (1.5 x TM x V x 0.008938)
V S = 5.0 V ± 0.25
(Output Source Current Operation)
5.0
4.5
S
4.0 TEMP = 0 to 85oC
3.5
3.0
2.5
2.0
1.5
1.0
0.5
MAX
MIN
NOM
0
PRESSURE (kPa)
Figure 4. Output vs. Absolute Pressure
MPXHZ6116A
Sensors
4
Freescale Semiconductor
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
MPXV2050GP SENSOR INTEG SILICON PRESSURE
MPXV7007GP PRESSURE SENSOR SIDE PORT 8-SOP
MR1-6LVW-WSP POWERWHITE LV WW SPOT OPTIC
MRF24J40MBT-I/RM IC TXRX 2.4GHZ 802.15.4
MRF24J40MCT-I/RM TXRX MOD 802.15.4 2.4GHZ 12MOD
MRF49XAT-I/ST IC RF TXRX 433/868/915 16-TSSOP
MRF89XA-I/MQ TXRX ISM SUB-GHZ ULP 32QFN
MRF89XAM9A-I/RM IC TXRX MOD 915MHZ ULP SUB-GHZ
相关代理商/技术参数
MPXHZ6117A 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated
MPXHZ6117A6T1 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated
MPXHZ6117A6U 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated
MPXHZ6117AC6T1 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated
MPXHZ6117AC6U 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated
MPXHZ6130A 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:INTEGRATED PRESSURE SENSOR 15 TO 130 kPa (2.2 TO 18.9 PSI) 0.2 TO 4.8 V OUTPUT
MPXHZ6130A6T1 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:INTEGRATED PRESSURE SENSOR 15 TO 130 kPa (2.2 TO 18.9 PSI) 0.2 TO 4.8 V OUTPUT
MPXHZ6130A6U 功能描述:板上安装压力/力传感器 SSOP INTEG ABSOLUTE RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides